Item
|
Capability
|
Max Capability
|
Layers
|
1-30 Layers
|
4-10 Layers
|
board thickness
|
0.2-6.4mm
|
0.32-6.4mm
|
HDI TYPE
|
1+N+1/2+N+2/3+N+3
|
1+N+1/2+N+2/3+N+3
|
Min laser drilling bit
|
110μm
|
80μm
|
laser dnlling capability
|
CO2 laser dnlling
|
CO2 laser dnlling
|
matenal
|
FR4/FR4 Halogen free
|
FR4/ Taconic/ Rogers/ others on request
|
TG
|
135/150/170
|
140/150/170/190
|
PP TYPE
|
106/1080/2116/1506/7628
|
106/1037/1080/2116/1506/7628/1078/2113
|
COPPER
|
12μm/18μm/35 μm/70μm/350μm
|
9μm/12μm / 18μm/ 35 μm/70 μm/105 μm/350μm
|
Copper into holes thickness
|
20 μm(25 μm)
|
13μm/20μm/25μm
|
Min width &space
|
75 μm/75 μm
|
50μm/50μm
|
sodlermask aglight
|
(+/-) 38μm
|
(+/-) 25μm
|
Min green soldermask bndge
|
60μm
|
50μm
|
soldermask
|
Green /white / black/ red/ blue
|
Greer/ white /black /red /blue
|
panel drawing
|
Min5mm*5mm Max 1200*500mm
|
Min5mm*5mm Max1200*500mm
|
production panel size
|
620mm*543mm
|
620mm*543mm
|
Min amdar ring
|
125μm
|
76μm
|
Mindrilling bit
|
0.2mm
|
0.1mm
|
Min routing bit
|
0.8mm
|
0.6mm
|
Surface
|
OSP/HASL LEAD FREE/lmmersion Tir/ ENIG/Plated NI/AU/ lmmersion Ag
|
OSP/ HASL LEAD FREE/ lmmersionTin/ ENIG/ Plated NI/AU/ lmmersion Ag
|